A-A-51145 Flux, Soldering, Non-Electronic, Paste and LiquidThis commercial item description CID covers soldering flux of the standard commercial type which is intended to be used in soldering copper, copper-base alloys, tin plate, carbon steels, alloy steels, corrosion resistant steels, and chromium alloys. This flux is not intended for use in soldering electronic or electrical circuits.

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A-A-51145D

manufacturing operations, is an acceptable practice to ascertain conformance to requirements, however, this does not authorize submission of known defective material, either indicated or actual, nor does it commit the Government to accept defective material.

5.4  Quality conformance.  Unless otherwise specified (see 7.3(e)), a soldering test shall be performed using a flux sample which is selected from the batch or batches used to fill the requirements of a specific contract.  A batch is defined as all the flux of the same type and form produced from the same group of raw materials under essentially the same conditions.

5.5  Soldering test.  Three test pieces 2 inches square shall be prepared from sheet chromium alloy.  A surface of each test piece shall be cleaned to a bright finish and coated with a thin film of flux from the sample.  A pool of 50150 tin-lead solder shall be melted on the fluxed surfaces. The fluxed area shall be covered with a bright continuous tightly adhering coat of solder without porosity.  A copper wire approximately 0.0508 inch in diameter shall be soldered to the center of each piece of metal.  Approximately 112 inch of wire shall be in contact with the test piece. Tension shall be applied to the wire in a direction parallel to the solder plane until the wire breaks.  Failure of the wire outside of the solder joint shall be indicative of an acceptable flux. Failure of the solder joint shall be cause for rejection of the flux.

6.  PACKAGING.  Preservation, packing, and marking shall be as specified (see 7.3(f)) in the contract or purchase order.

7.  NOTES

7.1  Part or identification number (PIN).  The following PIN procedure is for government purposes and does not constitute a requirement for the contractor.

AA51145 - X X

Form:  A - Paste

B - Liquid

Type:   1 - Type I   - For use with tin-lead solders for joining copper, copper-base alloys, tin plate, carbon steels, alloy steels, and corrosion resistant steels

2 - Type II  - For use in soldering chromium alloys

CID number

7.2  Sources of documents.

7.2.1  FAR.  A copy of the FAR may be obtained from the U.S. Government Printing Office, Superintendent of Documents, Mail Stop:  SSOP, Washington, DC  20402-9328.

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